Power path around 4 layer PCB

I'm designing a 4 layer PCB (Signal-GND-PWR-Signal) that has power input and motor connectors placed as seen in the picture. In order to avoid thick traces I traced a power path around the PCB composed of thinner tracks like in the picture on every layer and stitched them with vias.

My question is, would such design raise any EMI/SI issues? I'm concerned because it resembles a faraday cage except not wired to ground so I wonder if it would increase EMI rather than reducing it. I also would like to ask if the design would be better without the vias.

Thank you.